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Part Number |
BSM35GD120DN2 |
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Manufacturer |
Eupec GmbH |
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Semiconductor DataSheet |
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DataSheet View |
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BSM 35 GD 120 DN2
IGBT Power Module
• Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type BSM 35 GD 120 DN2 BSM35GD120DN2E3224 Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage RGE = 20 kΩ Gate-emitter voltage DC collector current TC = 25 °C TC = 80 °C Pulsed collector current, tp = 1 ms TC = 25 °C TC = 80 °C Power dissipation per IGBT TC = 25 °C Chip temperature Storage temperature Thermal resistance, chip case Diode thermal resistance, chip case Insulation test voltage, t = 1min. Creepage distance Clearance DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Tj Tstg RthJC RthJCD Vis Ptot 280 + 150 -40 ... + 125 ≤ 0.44 ≤ 0.8 2500 16 11 F 40 / 125 / 56 sec Vac mm K/W °C ICpuls 100 70 W VGE IC 50 35 Symbol VCE VCGR 1200 ± 20 A Values 1200 Unit V VCE IC Package ECONOPACK 2 ECONOPACK 2K Ordering Code C67076-A2506-A67 C67070-A2506-A67
1200V 50A 1200V 50A
1
Oct-20-1997
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BSM 35 GD 120 DN2
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol min. Static Characteristics Gate threshold voltage VGE = VCE, IC = 1.2 mA Collector-emitter saturation voltage VGE = 15 V, IC = 35 A, Tj = 25 °C VGE = 15 V, IC = 35 A, Tj = 125 °C Zero gate voltage collector current VCE = 1200 V, VGE = 0 V, Tj = 25 °C VCE = 1200 V, VGE = 0 V, Tj = 125 °C Gate-emitter leakage current VGE = 20 V, VCE = 0 V AC Characteristics Transconductance VCE = 20 V, IC = 35 A Input capacitance VCE = 25 V, VGE = 0 V, f = 1 MHz Output capacitance VCE = 25 V, VGE = 0 V, f = 1 MHz Reverse transfer capacitance VCE = 25 V, VGE = 0 V, f = 1 MHz Crss 0.14 Coss 0.3 Ciss 2 gfs 11 nF S IGES 150 ICES 0.6 2.4 1 nA VCE(sat) 2.7 3.3 3.2 3.9 mA VGE(th) 4.5 5.5 6.5 V Values typ. max. Unit
2
Oct-20-1997
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BSM 35 GD 120 DN2
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol min. Switching Characteristics, Inductive Load at Tj = 125 °C Turn-on delay time VCC = 600 V, VGE = 15 V, IC = 35 A RGon = 39 Ω Rise time VCC = 600 V, VGE = 15 V, IC = 35 A RGon = 39 Ω Turn-off delay time VCC = 600 V, VGE = -15 V, IC = 35 A RGoff = 39 Ω Fall time VCC = 600 V, VGE = -15 V, IC = 35 A RGoff = 39 Ω Free-Wheel Diode Diode forward voltage IF = 35 A, VGE = 0 V, Tj = 25 °C IF = 35 A, VGE = 0 V, Tj = 125 °C Reverse recovery time IF = 35 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/µs, Tj = 125 °C Reverse recovery charge IF = 35 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/µs Tj = 25 °C Tj = 125 °C 2 5 Qrr 0.25 µC trr VF 2.3 1.9 2.9 µs V 50 75 tf 400 600 td(off) 60 120 tr 60 120 td(on) ns Values typ. max. Unit
3
Oct-20-1997
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BSM 35 GD 120 DN2
Power dissipation Ptot = ƒ(TC) parameter: Tj ≤ 150 °C
300 W 260 Ptot 240 220 200 180 160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120 °C 160
Safe operating area IC = ƒ(VCE) parameter: D = 0, TC = 25°C , Tj ≤ 150 °C
10 3 A IC 10 2
t = 18.0µs p
100 µs
10 1
1 ms
10 0
10 ms
DC 10
-1
10
0
10
1
10
2
10
3
V
TC
VCE
Collector current IC = ƒ(TC) parameter: VGE ≥ 15 V , Tj ≤ 150 °C
55 A IC 45 40 35 30 25 20 15 10 5 0 0 20 40 60 80 100 120 °C 160
Transient thermal impedance Zth JC = ƒ(tp) parameter: D = tp / T
10 0 K/W ZthJC 10 -1
IGBT
10 -2
D = 0.50 0.20 0.10 single pulse 0.05 0.02 0.01
10 -3
10 -4 -5 10
10
-4
10
-3
10
-2
10
-1
s 10
0
TC
tp
4
Oct-20-1997
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BSM 35 GD 120 DN2
Typ. output characteristics IC = f (VCE) parameter: tp = 80 µs, Tj = 25 °C
70 A 60 IC 55 50 45 40 35 30 25 20 15 10 5 0 0 1 2 3 V VCE 5 17V 15V 13V 11V 9V 7V
Typ. output characteristics IC = f (VCE) parameter: tp = 80 µs, Tj = 125 °C
70 A 60 IC 55 50 45 40 35 30 25 20 15 10 5 0 0 1 2 3 V VCE 5 17V 15V 13V 11V 9V 7V
Typ. transfer characteristics IC = f (VGE) parameter: tp = 80 µs, VCE = 20 V
70 A 60 IC 55 50 45 40 35 30 25 20 15 10 5 0 0
2
4
6
8
10
V 14 VGE
5
Oct-20-1997
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BSM 35 GD 120 DN2
Typ. gate charge VGE = (QGate) parameter: IC puls = 35 A
20 V
Typ. capacitances
C = f (VCE)
parameter: VGE = 0 V, f = 1 MHz
10 1
nF VGE 16 14 12 10 8 10 -1 6 4 2 0 0 40 80 120 160 nC 220 10 -2 0 5 10 15 20 25 30 V VCE 40 Coss Crss 600 V 800 V C 10 0 Ciss
QGate
Reverse biased safe operating area ICpuls = f(VCE) , Tj = 150°C parameter: VGE = 15 V
2.5
Short circuit safe operating area ICsc = f(VCE) , Tj = 150°C parameter: VGE = ± 15 V, tSC 10 µs, L < 50 nH
12
ICpuls/IC
ICsc/IC
8 1.5 6 1.0 4 0.5
2
0.0 0
200
400
600
800
1000 1200
V 1600 VCE
0 0
200
400
600
800
1000 1200
V 1600 VCE
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Oct-20-1997
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BSM 35 GD 120 DN2
Typ. switching time I = f (IC) , inductive load , Tj = 125°C par.: VCE = 600 V, VGE = ± 15 V, RG = 39
10 3
Typ. switching time t = f (RG) , inductive load , Tj = 125°C par.: VCE = 600 V, VGE = ± 15 V, IC = 35 A
10 3 tdoff
t
tdoff ns
t
ns tdon tr
10
2
tr tdon tf
10
2
tf
10 1 0
10
20
30
40
50
60
A IC
80
10 1 0
20
40
60
80
100 120 140 RG
180
Typ. switching losses E = f (IC) , inductive load , Tj = 125°C par.: VCE = 600 V, VGE = ± 15 V, RG = 39
20 mWs E 16 14 12 10 8 Eoff 6 4 2 0 0 10 20 30 40 50 60 A IC 80 Eon
Typ. switching losses E = f (RG) , inductive load , Tj = 125°C par.: VCE = 600V, VGE = ± 15 V, IC = 35 A
20 mWs E 16 14 Eon 12 10 8 6 4 2 0 0 20 40 60 80 100 120 140 RG 180
Eoff
7
Oct-20-1997
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BSM 35 GD 120 DN2
Forward characteristics of fast recovery reverse diode IF = f(VF) parameter: Tj
70 A 60 IF 55 50 45 40 35 30 25 20 15 10 5 0 0.0 0.5 1.0 1.5 2.0 V VF 3.0 Tj=125°C Tj=25°C
Transient thermal impedance Zth JC = (tp) parameter: D = tp / T
10 0
Diode
K/W ZthJC 10 -1
D = 0.50 0.20 10 -2 0.10 0.05 single pulse 0.02 0.01
10 -3 -5 10
10
-4
10
-3
10
-2
10
-1
s 10
0
tp
8
Oct-20-1997
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BSM 35 GD 120 DN2
Circuit Diagram
Package Outlines Dimensions in mm Weight: 180 g
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Oct-20-1997
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