Right Angle SMT LED

Part  Number BR1113F
Manufacturer Stanley Electric
Semiconductor DataSheet

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www.DataSheet4U.com Product Guide 1113F Series, Right Angle SMT LED s Features • Smaller size while maintaining the same brightness • levels as the 1101F series • Excellent for edge lighting s Applications • Portable devices • Computers • Industrial / medical instrumentation s Outline Dimensions Cathode Mark Cathode Unit: mm Tolerances + 0.1 s Electro-Optical Characteristics Part No. Material Emitted Lens Color Color GaAIAs GaP GaP Red Yellow-Green Green Milky White (Ta=25°C) Wavelength Peak λp TYP. Dominant λd TYP. Spectral Line Half Width λ ∆λ TYP. IF Luminous Intensity IV MIN. TYP. IF Forward Voltage VF TYP. MAX. IF Reverse Viewing Current IR Angle MAX. VR (2 θ 1/2) BR1113F PY1113F PG1113F 7 7 11.7 20 11.7 20 20 mA 660 570 560 647 572 567 nm 30 30 30 20 20 20 mA 1.7 2.1 2.1 V 2.3 2.8 2.8 20 20 20 mA 100 100 100 µA 4 4 4 V 130° 150° Deg. 3.8 6.4 mcd Units www.DataSheet4U.com s Absolute Maximum Ratings Red Yellow-Green PY 70 25 60 4 -30 to +85 -40 to +100 0.36 (DC) 0.86 (Pulse) Green (Ta=25°C) Item Symbol Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg ∆IF BR 57.5 25 60 4 PG 70 25 60 4 Units mW mA mA V °C °C mA/°C * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. s Taping Specifications φ 1.5 +0.1 0 (1.1) 1.75+0.1 s Operation Current Derating Chart (DC) 4+0.1 (0.2) Center Hole 8+0.2 (2.2) (φ 0.6) Center Hole 4+0.1 2+0.05 3.5+0.05 Quantity on tape: 4000 pieces per reel 2+0.5 φ 21+0.8 (0.8) Direction to pull φ 13+0.2 +1 φ 60 -0 φ 13+0.2 BR, PY, PG, 9+0.3 11.4+1 +0 φ 180 3 s Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: LED Surface Temperature °C Operation Heating 240 Temperature rise: 5°C/sec. Cooling: —5°C/sec. s Spatial Distribution 150 120 Pre-heating 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG__1113F-0301 ~ 0 60 to 120 sec. 5 sec. max Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com




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