LED Lamps

www.DataSheet4U.com Product Guide 1111R Series Reverse Mount SMT LED s Features • Designed to be mounted on one side of the PCB • with light emitting through a hole. • Eliminates the need for second reflow soldering • Excellent for status indicator and edge lighting s Applications • Mobile Devices (cellular phones, pagers, PDAs) • Computers • Telecommunication s Outline Dimensions Epoxy PCB Unit: mm Tolerances + 0.1 s Electro-Optical Characteristics Type No. Material Emitted Color GaAIAs GaAsP GaAsP GaP GaP GaP Red Orange Yellow Yellow Green Green Pure Green (Ta=25°C) Wavelength IF Peak λp TYP. Spectral Line Dominant Half Width λd λ ∆λ TYP. TYP. IF Lens Color Luminous Intensity IV MIN. TYP. Forward Voltage V TYP MAX. F Reverse Viewing Current IR Angle MAX. VR IF (2 θ 1/2) BR1111R AA1111R AY1111R PY1111R PG1111R BG1111R 7.6 2.2 Milky White 12.7 20 660 3.7 3.7 6.9 2.7 20 605 20 580 20 560 20 555 mA 647 606 590 572 567 558 nm 30 30 30 30 30 30 20 20 20 20 20 20 mA 1.7 2.3 2.2 2.8 2.2 2.8 2.1 2.8 2.1 2.8 2.1 2.8 V 20 20 20 20 20 20 mA 100 100 100 100 100 100 µA 4 4 4 4 4 4 V 140° 2.2 7.6 4.1 1.6 12.7 20 570 150° Units mcd Deg. www.DataSheet4U.com s Absolute Maximum Ratings Red Orange AA 70 25 60 4 Yellow AY 70 25 60 4 -30 to +85 -40 to +100 0.36 (DC) 0.86 (Pulse) (Ta=25°C) Yellow Green PY 70 25 60 4 Green PG 70 25 60 4 Pure Green BG 70 25 60 4 mW mA mA V °C °C mA/°C Item Symbol Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg ∆IF BR 57.5 25 60 4 Units * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. s Taping Specifications 1.75 + 0.1 s Operation Current Derating Chart (DC) 4 + 0.1 φ 1.5 +0.1 0 (1.8) (0.2) Center Hole 8+ 0.2 (3.5) ( φ 1.1) Center Hole 4 + 0.1 2 + 0.05 3.5 + 0.0 5 (0.5) (1.45) Quantity on tape: 3,000 pieces per reel 2+0.5 Direction to pull φ 21+0.8 BR, AA, AY, PY, PG, BG +1 φ 60 -0 φ 13+0.2 φ 13+0.2 9+0.3 11.4+1 +0 φ 180 3 s Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: LED Surface Temperature °C Operation Heating 240 Temperature rise: 5°C/sec. Cooling: —5°C/sec. s Spatial Distribution 150 120 Pre-heating 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1111R-0301 ~ 0 60 to 120 sec. 5 sec. max Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com