Description
DATA SHEET B1S~B10S MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER VOLTAGE - 100 to 1000 Volts FEATURES • Plastic material used carries Underwriters • Laboratory recognition 94V-O • Low leakage .0310 (0.8) .0191 (0.5) CURRENT - 0.5 Amperes Unit: inch ( mm ) MDI .275 (7) MAX .165 (4.2) .150 (3.8) .106 (2.7) .193 (4.9) .177 (4.5) .090 (2.3) .106 (2.7) .090 (2.3) • Surge overload rating-- 30 amperes peak • Ideal for printed circuit board • Exceeds environmental standards of MIL-S-19500 MECHANICAL DATA Case: Reliable low cost construction utilizing molded plastic technique results in inexpensive product Terminals: Lead solderable per MIL-STD-202, Method 208. Polarity: Polarity symbols molded or marking on body. Mounting Position: Any. Weight: 0.008 ounce, 0.22 gram. .067 (1.7) .014 (0.35) .006 (0.15) .051 (1.3) .035 (0.9) .057 (1.3) C .02(5) .008 (.20) .043 (1.1) .027 (0.7) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, Resistive or inductive load. For capacitive load, derate current by 20% B1S Maximum Recurrent Peak Reverse Voltage Maximum RMS Bridge input Voltage Maximum DC Blocking Voltage Maximum Average Forward on glass-epoxy P.C.B (Note 1) Current TA=30°C on aluminum substrate (Note 3) B2S B4S B6S B8S B10S UNIT V V V A 100 70 100 200 140 200 400 280 400 600 420 600 0.5 0.8 30.0 5.0 1.00 5.0 25.0 85.0 800 560 800 1000 700 1000 Peak Forward Surge Current, 8.3ms singlehalf sine-wave superimposed on rated load I 2t Rating for fusing ( t < 8.35 ms) Maximum Forward Voltage Drop per Bridge Element at 0.5A Maximum Reverse Current at Rated TJ= 25°C DC Blocking Voltage per element TJ=125°C Typical Junction capacitance per leg (Note 1) CJ Typical Thermal resistance per leg (Note 2) RθJA Typical Thermal resistance per leg (Note 2) RθJA Operating Temperature Range TJ Storage Temperature Range TA NOTES: A A2t V µA mA pF °C/W °C °C -55 to 150 -55 to 150 1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts 2. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.05 X 0.05"(13 x 13mm) copper pads. 3. On alum: substrate P.C.B with an rea of 0.8 x 0.8 x 0.25” ( 20 x 20 x 6.4mm ) mounte on 0.05 x 0.05 “( 13 x 13 mm ) solder pad. PAGE . 1 RATING AND CHARACTERISTIC CURVES 0.8 On aluminun substtrate 0.6 FORWARD SURGE CURRENT, AMPERES pk (HALF-SINE WAVE) 50 40 AVERAGE FORWARD OUTPUT CURRENT, AMPERES 0.4 On Glass P.C.B 30 20 0.2 10 1 2 4 6 8 10 20 40 60 80 100 0 20 40 60 80 100 120 140 160 NUMBER OF CYCLES AT 60Hz AMBIENT TEMPERATURE, OC Fig.1-MAXIMUM NON-REPETITIVE SURGE CURRENT Fig.2-DERATING CURVE FOR OUTPUT RECTIFIED CURRENT 10 INSTANTANEOUS FORWARK CURRENT, AMPERES 10 1.0 INSTANTANEOUS REVERSE CURRENT, MICROAMPERES 1.0 0.1 0.1 0.01 0.4 0.6 0.8 1.0 1.2 1.4 0.01 0 20 40 60 80 100 120 140 INSTANTANEOUS FORWARD VOLTAGE, VOLTS PERCENT OF PEAK REVERSE VOLTAGE Fig.3-TPICAL FORWARD CHARACTERISTICS Fig.4-TYPICAL REVERSE CHARACTERISTICS PAGE . 2

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B10S

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