SMD CHIP LED LAMP

2.0x1.25mm SMD CHIP LED LAMP APTC2012SYC SUPER BRIGHT YELLOW Features !2.0mmx1.25mm SMT LED,0.75mm THICKNESS. !LOW Description The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. !WIDE !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS !PACKAGE Package Dimensions www.DataSheet4U.com Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0957 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN: S.J.HOU PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APTC2012SYC SUPER BRIGHT YELLOW (InGaAlP) WATER CLEAR 36 Ty p . 100 V i ew i n g An g l e 2θ1/2 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°C ° Sy m b o l λpeak λD ∆λ1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current D ev i c e Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p . 590 588 28 25 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA V F =0V;f =1MHz I F =20mA V R = 5V Absolute Maximum Ratings at T)=25°C ° Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Yello w 12 5 30 150 5 -40°C To +85°C Un it s mW mA mA V SPEC NO: DSAD0957 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN: S.J.HOU PAGE: 2 OF 4 Super Bright Yellow APTC2012SYC SPEC NO: DSAD0957 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN: S.J.HOU PAGE: 3 OF 4 APTC2012SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0957 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN: S.J.HOU PAGE: 4 OF 4