SMD CHIP LED LAMP

Part  Number APTC2012CGCK
Manufacturer Kingbright Corporation
Semiconductor DataSheet

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2.0x1.25mm SMD CHIP LED LAMP APTC2012CGCK GREEN Features !2.0mmx1.25mm SMT LED,0.75mm THICKNESS. !LOW Description The Green source color devices are made with InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. !WIDE !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS !PACKAGE Package Dimensions www.DataSheet4U.com Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0960 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN:S.J.HOU PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APTC2012CGCK GREEN(InGaAIP) WATER CLEAR 15 Ty p . 40 V i ew i n g An g l e 2θ1/2 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°C ° Sy m b o l λpeak λD ∆λ1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Green Green Green Green Green Green D ev i c e Ty p . 574 570 20 15 2.1 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF = 2 0 m A IF = 2 0 m A IF = 2 0 m A V F = 0 V; f = 1 M Hz IF = 2 0 m A VR = 5V Absolute Maximum Ratings at T)=25°C ° Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Gr een 105 30 150 5 -40°C To +85°C Un it s mW mA mA V SPEC NO: DSAD0960 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN:S.J.HOU PAGE: 2 OF 4 Green APTC2012CGCK SPEC NO: DSAD0960 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN:S.J.HOU PAGE: 3 OF 4 APTC2012CGCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0960 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN:S.J.HOU PAGE: 4 OF 4




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