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Part Number |
AP4501M |
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Manufacturer |
Advanced Power Electronics |
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Semiconductor DataSheet |
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DataSheet View |
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AP4501M
Advanced Power Electronics Corp.
▼ Simple Drive Requirement ▼ Low On-resistance ▼ Fast Switching
D1 G2 S2 D2 D1 D2
N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET
N-CH BVDSS RDS(ON) ID P-CH BVDSS RDS(ON) ID
30V 28mΩ 7A -30V 50mΩ -5.3A
SO-8
S1
G1
Description
The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and costeffectiveness. The SO-8 package is universally preferred for all commercialindustrial surface mount applications and suited for low voltage applications such as DC/DC converters.
G1
D1
D2
G2 S1 S2
Absolute Maximum Ratings
Symbol VDS VGS ID@TA=25℃ ID@TA=70℃ IDM PD@TA=25℃ TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current
1 3 3
Rating N-channel 30 ±20 7 5.8 20 2 0.016 -55 to 150 -55 to 150 P-channel -30 ±20 -5.3 -4.7 -20
Units V V A A A W W/℃ ℃ ℃
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-amb Parameter Thermal Resistance Junction-ambient 3 Max. Value 62.5 Unit ℃/W
Data and specifications subject to change without notice
201225022
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AP4501M
N-CH Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS
ΔBVDSS/ΔTj
Parameter Drain-Source Breakdown Voltage
2
Test Conditions VGS=0V, ID=250uA
Min. Typ. Max. Units 30 1 0.02
28 42 3 1 25 -
V V/℃ mΩ mΩ V S uA uA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=7A VGS=4.5V, ID=5A
13 8.4 2.1 4.7 6 5.2 18.8 4.4 645 150 95
VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25oC) Drain-Source Leakage Current (Tj=70 C)
o
VDS=VGS, ID=250uA VDS=10V, ID=7A VDS=30V, VGS=0V VDS=24V, VGS=0V VGS=±20V ID=7A VDS=24V VGS=4.5V VDS=15V ID=1A RG=3.3Ω,VGS=10V RD=15Ω VGS=0V VDS=25V f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
±100 nA
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
Source-Drain Diode
Symbol IS VSD Parameter
Continuous Source Current ( Body Diode )
Test Conditions VD=VG=0V , VS=1.2V Tj=25℃, IS=7A, VGS=0V
Min. Typ. Max. Units 1.67 1.2 A V
Forward On Voltage
2
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AP4501M
P-CH Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS
ΔBVDSS/ΔTj
Parameter Drain-Source Breakdown Voltage Static Drain-Source On-Resistance Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (T j=25 C) Drain-Source Leakage Current (T j=70 C)
o o
Test Conditions VGS=0V, ID=-250uA
2
Min. Typ. Max. Units -30 -1 -0.028
50 90 -3 -1 -25 -
V V/℃ mΩ mΩ V S uA uA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=-1mA
RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
VGS=-10V, ID=-5.3A VGS=-4.5V, ID=-4.2A VDS=VGS, ID=-250uA VDS=-10V, ID=-5.3A VDS=-30V, VGS=0V VDS=-24V, VGS=0V VGS= ± 20V ID=-5.3A VDS=-15V VGS=-10V VDS=-15V ID=-1A RG=6Ω,VGS=-10V RD=15Ω VGS=0V VDS=-15V f=1.0MHz
8.5 20 3.5 2 12 20 45 27 790 440 120
Gate-Source Leakage Total Gate Charge
2
±100 nA
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
Source-Drain Diode
Symbol IS VSD Parameter
Continuous Source Current ( Body Diode )
Test Conditions VD=VG=0V , VS=-1.2V Tj=25℃, IS=-2.6A, VGS=0V
Min. Typ. Max. Units -1.67 -1.2 A V
Forward On Voltage
2
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse width <300us , duty cycle <2%. 3.Surface mounted on 1 in2 copper pad of FR4 board ; 135℃/W when mounted on Min. copper pad.
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AP4501M
N-Channel
36
10V 8.0V 6.0V 5.0V ID , Drain Current (A) ID , Drain Current (A) V GS =4.5V
36
10V 8.0V 6.0V 5.0V
24
24
V GS =4.5V
12
12
T C =25 o C
0 0 2 3 5 6
T C =150 o C
0 0 2 3 5 6
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
90
2
I D =7.0A T C =25 ℃
70 1.4
I D =7.0A V GS = 10V
50
Normalized RDS(ON)
2 6 10 14
RDS(ON) (mΩ )
0.8
30
10
0.2 -50 0 50 100 150
V GS (V)
T j , Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
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AP4501M
N-Channel
2.4
8
6
1.8
ID , Drain Current (A)
PD (W)
4
1.2
2
0.6
0 25 50 75 100 125 150
0 0 50 100 150
T c , Case Temperature ( C)
o
T c ,Case Temperature ( o C)
Fig 5. Maximum Drain Current v.s.
Fig 6. Typical Power Dissipation
Case Temperature
100
1
Duty Factor = 0.5
10
Normalized Thermal Response (Rthja)
0.2
1ms
0.1
0.1
0.05
ID (A)
1
10ms 100ms 1s
0.02
0.01
PDM
0.01
Single Pulse
t T
0.1
T C =25 o C Single Pulse
0.01 0.1 1 10
10s DC
Duty Factor = t/T Peak Tj = P DM x R thja + Ta Rthja=135 C/W
o
0.001
100
0.0001
0.001
0.01
0.1
1
10
100
1000
V DS (V) t , Pulse Width (s)
Fig 7. Maximum Safe Operating Area
Fig 8. Effective Transient Thermal Impedance
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AP4501M
N-Channel
f=1.0MHz
12 10000
I D =7.0A
VGS , Gate to Source Voltage (V)
9
6
C (pF)
V DS= 1 6 V V DS =20V V DS =24V
1000
Ciss
100 3
Coss Crss
0 0 4 8 12 16
10 1 7 13 19 25 31
Q G , Total Gate Charge (nC)
V DS (V)
Fig 9. Gate Charge Characteristics
Fig 10. Typical Capacitance Characteristics
100
3
2.5
10 2
VGS(th) (V)
T C = 150 C
IS(A)
1
o
T C =25 C
o
1.5
1 0.1 0.5
0.01 0 0.4 0.8 1.2
0 -50 0 50 100 150
V SD (V)
T j , Junction Temperature ( C )
o
Fig 11. Forward Characteristic of
Reverse Diode
Fig 12. Gate Threshold Voltage v.s. Junction Temperature
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AP4501M
N-Channel
VDS
RD
90%
D
VDS
TO THE OSCILLOSCOPE 0.5 x RATED VDS
RG
G
+ 10V -
S VGS
10% VGS td(on) tr td(off) tf
Fig 13. Switching Time Circuit
Fig 14. Switching Time Waveform
VG
VDS TO THE OSCILLOSCOPE
QG 4.5V
D
0.8 x RATED VDS G S
+
QGS
VGS
QGD
1~ 3 mA
I
G
I
D
Charge
Q
Fig 15. Gate Charge Circuit
Fig 16. Gate Charge Waveform
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AP4501M
P-Channel
20
20
10V 8.0V 6.0V
15
10V 8.0V 6.0V
15
-ID , Drain Current (A)
V GS =4. 0 V
10
-ID , Drain Current (A)
V GS =4. 0 V
10
5
5
T C =25 o C
0 0 1 2 3 4
T C =150 o C
0 0 1 2 3 4
-V DS , Drain-to-Source Voltage (V)
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
90
1.8
I D =-5.3A T C =25 ℃
80 1.6
I D =-5.3A V GS = -10V
Normalized RDS(ON)
70
1.4
RDS(ON) (mΩ )
60
1.2
50
1
40
0.8
30 3 4 5 6 7 8 9 10 11
0.6 -50 0 50 100 150
-V GS (V)
T j , Junction Temperature ( o C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
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AP4501M
P-Channel
6
2.4
5 1.8
-ID , Drain Current (A)
4
3
2 0.6 1
0 25 50 75 100 125 150
PD (W)
1.2
0 0 50 100 150
T c , Case Temperature ( C)
o
T c ,Case Temperature ( o C)
Fig 5. Maximum Drain Current v.s.
Fig 6. Typical Power Dissipation
Case Temperature
100
1
Duty Factor = 0.5
Normalized Thermal Response (R thja)
0.2
10
1ms
0.1
0.1
0.05
-ID (A)
1
10ms 100ms 1s
0.02
0.01
PDM
0.01
Single Pulse
t T
0.1
T C =25 o C Single Pulse
0.01 0.1 1 10
10s DC
Duty Factor = t/T Peak Tj = P DM x Rthja + Ta Rthja=135 oC/W
0.001 100 0.0001 0.001 0.01 0.1 1 10 100 1000
-V DS (V)
t , Pulse Width (s)
Fig 7. Maximum Safe Operating Area
Fig 8. Effective Transient Thermal Impedance
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AP4501M
P-Channel
14
10000
f=1.0MHz
12
I D =-5.3A
-VGS , Gate to Source Voltage (V)
10
8
C (pF)
V DS =-10V V DS =-15V V DS =-20V
1000
Ciss Coss
6
100
4
Crss
2
0 0 5 10 15 20 25 30
10 1 5 9 13 17 21 25 29
Q G , Total Gate Charge (nC)
-V DS (V)
Fig 9. Gate Charge Characteristics
Fig 10. Typical Capacitance Characteristics
100.00
3
2.5
10.00
2
-IS(A)
T j =150 o C
1.00
T j =25 o C
-VGS(th) (V)
1.5
1
0.10
0.5
0.01 0.1 0.4 0.7 1 1.3
0 -50 0 50 100 150
-V SD (V)
T j ,Junction Temperature ( o C)
Fig 11. Forward Characteristic of
Reverse Diode
Fig 12. Gate Threshold Voltage v.s. Junction Temperature
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AP4501M
P-Channel
VDS
RD
90%
D
VDS
TO THE OSCILLOSCOPE 0.5 x RATED VDS
RG
G
10%
S -10 V VGS
VGS td(on) tr td(off) tf
Fig 13. Switching Time Circuit
Fig 14. Switching Time Waveform
VG
VDS TO THE OSCILLOSCOPE
QG -10V
D
G S -1~-3mA I
G
0.5 x RATED VDS
QGS
QGD
VGS
ID
Charge
Q
Fig 15. Gate Charge Circuit
Fig 16. Gate Charge Waveform
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