(56F8167 / 56F8367) 16-bit Digital Signal Controllers



Part  Number 56F8367
Manufacturer Freescale Semiconductor
Semiconductor DataSheet

DataSheet View

www.DataSheet4U.com 56F8367/56F8167 Data Sheet Preliminary Technical Data 56F8300 16-bit Digital Signal Controllers MC56F8367 Rev. 8 01/2007 freescale.com Document Revision History Version History Rev 0 Rev 1.0 Rev 2.0 Description of Change Pre-release, Alpha customers only Initial Public Release Added output voltage maximum value and note to clarify in Table 10-1.; also removed overall life expectancy note, since life expectancy is dependent on customer usage and must be determined by reliability engineering. Clarified value and unit measure for Maximum allowed PD in Table 10-3. Corrected note about average value for Flash Data Retention in Table 10-4. Added new RoHS-compliant orderable part numbers in Table 13-1. Added 160MAPBGA information, TA equation updated in Table 10-4 and additional minor edits throughout data sheet Deleted formula for Max Ambient Operating Temperature (Automotive) and Max Ambient Operating Temperature (Industrial) and corrected Flash Endurance to 10,000 in Table 10-4. Added RoHS-compliance and “pb-free” language to back cover. Correcting MBGA pin assignments in Table 2-2 for MOSI0 and MISO0 Added information/corrected state during reset in Table 2-2. Clarified external reference crystal frequency for PLL in Table 10-14 by increasing maximum value to 8.4MHz. Corrected CLKO and HOME1 labels in Figure 11-2 and Table 11-2; replaced “Tri-stated” with an explanation in State During Reset column in Table 2-2. • Added the following note to the description of the TMS signal in Table 2-2: Note: Always tie the TMS pin to VDD through a 2.2K resistor. • Added the following note to the description of the TRST signal in Table 2-2: Note: For normal operation, connect TRST directly to VSS. If the design is to be used in a debugging environment, TRST may be tied to VSS through a 1K resistor. Rev 3.0 Rev 4.0 Rev 5.0 Rev 6.0 Rev 7.0 Rev. 8 Please see http://www.freescale.com for the most current data sheet revision. 56F8367 Technical Data, Rev. 8 2 Freescale Semiconductor Preliminary 56F8367/56F8167 General Description Note: Features in italics are NOT available in the 56F8167 device. • Up to 60 MIPS at 60MHz core frequency • DSP and MCU functionality in a unified, C-efficient architecture • Access up to 4MB of off-chip program and 32MB of data memory • Chip Select Logic for glueless interface to ROM and SRAM • 512KB of Program Flash • 4KB of Program RAM • 32KB of Data Flash • 32KB of Data RAM • 32KB Boot Flash • Up to two 6-channel PWM modules • Four 4-channel, 12-bit ADCs RSTO EMI_MODE EXTBOOT 5 VPP 2 VCAP 4 OCR_DIS VDD VSS 7 6 Digital Reg VDDA 2 Analog Reg VSSA * Configuration shown for on-chip 2.5V regulator • Temperature Sensor • Up to two Quadrature Decoders • Optional on-chip regulator • Up to two FlexCAN modules • Two Serial Communication Interfaces (SCIs) • Up to two Serial Peripheral Interfaces (SPIs) • Up to four general-purpose Quad Timers • Computer Operating Properly (COP) / Watchdog • JTAG/Enhanced On-Chip Emulation (OnCE™) for unobtrusive, real-time debugging • Up to 76 GPIO lines • 160-pin LQFP Package and 160 MAPBGA RESET 6 3 4 6 3 4 4 4 5 4 4 PWM Outputs Current Sense Inputs or GPIOC Fault Inputs PWM Outputs Current Sense Inputs or GPIOD Fault Inputs AD0 AD1 VREF AD0 AD1 PWMA JTAG/ EOnCE Port 16-Bit 56800E Core Low Voltage Supervisor Bit Manipulation Unit PWMB Program Controller and Hardware Looping Unit Address Generation Unit Data ALU 16 x 16 + 36 -> 36-Bit MAC Three 16-bit Input Registers Four 36-bit Accumulators ADCA PAB PDB CDBR CDBW Memory ADCB Program Memory 256K x 16 Flash 2K x 16 RAM Boot ROM 16K x 16 Flash R/W Control XDB2 XAB1 XAB2 External Address Bus Switch 6 2 8 4 3 External Data Bus Switch A0-5 or GPIOA8-13 A6-7 or GPIOE2-3 A8-15 or GPIOA0-7 GPIOB0-3 (A16-19) GPIOB4 (A20, prescaler_clock) GPIOB5-7 (A21-23, clk0-3**) D0-6 or GPIOF9-15 D7-15 or GPIOF0-8 WR RD GPIOD2-5 or CS4 -7 PS / CS0 (GPIOD8) DS / CS1 (GPIOD9) GPIOD0 (CS2 or CAN2_TX) GPIOD1 (CS3 or CAN2_RX) Temp_Sense Quadrature Decoder 0 or Quad Timer A or GPIOC Quadrature Decoder 1 or Quad Timer B or SPI1 or GPIOC Quad Timer C or GPIOE Quad Timer D or GPIOE FlexCAN 4 Data Memory 16K x 16 Flash 16K x 16 Flash PDB CDBR CDBW External Bus Interface Unit PAB System Bus Control 7 9 4 IPBus Bridge (IPBB) Decoding Peripherals Clock resets Bus Control 4 2 Peripheral Device Selects RW Control IPAB IPWDB IPRDB GPIO or EMI CS or FlexCAN2 4 2 PLL SPI0 or GPIOE 4 SCI1 or GPIOD 2 SCI0 or GPIOE 2 COP/ Watchdog Interrupt Controller IRQA IRQB System O Integration R Module CLKO P O Clock Generator S C XTAL EXTAL **See Table 2-2 for explanation CLKMODE 56F8367/56F8167 Block Diagram 56F8367 Technical Data, Rev. 8 Freescale Semiconductor Preliminary 3 Table of Contents Part 1: Overview. . . . . . . . . . . . . . . . . . . . . . . 5 1.1. 1.2. 1.3. 1.4. 1.5. 1.6. 56F8367/56F8167 Features . . . . . . . . . . . . . 5 Device Description . . . . . . . . . . . . . . . . . . . . 7 Award-Winning Development Environment . 9 Architecture Block Diagram . . . . . . . . . . . . . 10 Product Documentation . . . . . . . . . . . . . . . . 14 Data Sheet Conventions . . . . . . . . . . . . . . . 14 Part 8: General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . . . 132 8.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . 132 8.2. Memory Maps . . . . . . . . . . . . . . . . . . . . . . 132 8.3. Configuration. . . . . . . . . . . . . . . . . . . . . . . . 133 Part 9: Joint Test Action Group (JTAG) . . 137 9.1. 56F8367 Information. . . . . . . . . . . . . . . . . 137 Part 2: Signal/Connection Descriptions . . . 15 2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.2. Signal Pins . . . . . . . . . . . . . . . . . . . . . . . . . 18 Part 10: Specifications. . . . . . . . . . . . . . . . 138 10.1. General Characteristics . . . . . . . . . . . . . . 138 10.2. DC Electrical Characteristics. . . . . . . . . . 142 10.3. AC Electrical Characteristics . . . . . . . . . . 146 10.4. Flash Memory Characteristics. . . . . . . . . 146 10.5. External Clock Operation Timing . . . . . . 147 10.6. Phase Locked Loop Timing. . . . . . . . . . . 147 10.7. Crystal Oscillator Timing . . . . . . . . . . . . . 148 10.8. External Memory Interface Timing . . . . . . 148 10.9. Reset, Stop, Wait, Mode Select, and Interrupt Timing . . . . . . . . . . . . . 151 10.10. Serial Peripheral Interface (SPI) Timing . . . . . . . . . . . . . . . . . 153 10.11. Quad Timer Timing . . . . . . . . . . . . . . . . 157 10.12. Quadrature Decoder Timing . . . . . . . . . . 157 10.13. Serial Communication Interface (SCI) Timing . . . . . . . . . . . . . . . . 158 10.14. Controller Area Network (CAN) Timing . 159 10.15. JTAG Timing . . . . . . . . . . . . . . . . . . . . . 159 10.16. Analog-to-Digital Converter (ADC) Parameters . . . . . . . . . . . 161 10.17. Equivalent Circuit for ADC Inputs . . . . . 164 10.18. Power Consumption . . . . . . . . . . . . . . . 164 Part 3: On-Chip Clock Synthesis (OCCS) . 39 3.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.2. External Clock Operation . . . . . . . . . . . . . . 39 3.3. Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Part 4: Memory Operating Modes (MEM). . 41 4.1. 4.2. 4.3. 4.4. 4.5. 4.6. 4.7. 4.8. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . Program Map . . . . . . . . . . . . . . . . . . . . . . . Interrupt Vector Table . . . . . . . . . . . . . . . . . Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash Memory Map . . . . . . . . . . . . . . . . . . . EOnCE Memory Map . . . . . . . . . . . . . . . . . Peripheral Memory Mapped Registers . . . . Factory Programmed Memory. . . . . . . . . . . 41 42 43 47 47 49 49 80 Part 5: Interrupt Controller (ITCN) . . . . . . . . 81 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 81 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Functional Description . . . . . . . . . . . . . . . . . 81 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 83 Operating Modes . . . . . . . . . . . . . . . . . . . . . 83 Register Descriptions . . . . . . . . . . . . . . . . . 84 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Part 11: Packaging . . . . . . . . . . . . . . . . . . 166 11.1. 56F8367 Package and Pin-Out Information . . . . . . . . . . . . . . . . . . 166 11.2. 56F8167 Package and Pin-Out Information . . . . . . . . . . . . . . . . . 173 Part 6: System Integration Module (SIM) . 111 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 6.7. 6.8. 6.9. Overview . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Modes . . . . . . . . . . . . . . . . . . . Operating Mode Register . . . . . . . . . . . . . Register Descriptions . . . . . . . . . . . . . . . . Clock Generation Overview . . . . . . . . . . . Power Down Modes Overview . . . . . . . . . Stop and Wait Mode Disable Function . . . Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 111 112 112 113 127 128 128 129 Part 12: Design Considerations . . . . . . . . 177 12.1. Thermal Design Considerations . . . . . . . 177 12.2. Electrical Design Considerations . . . . . . 178 12.3. Power Distribution and I/O Ring Implementation . . . . . . . . . . . . . . 179 Part 13: Ordering Information . . . . . . . . . . 180 Part 7: Security Features . . . . . . . . . . . . . . 129 7.1. Operation with Security Enabled . . . . . . . . 129 7.2. Flash Access Blocking Mechanisms . . . . 130 56F8367 Technical Data, Rev. 8 4 Freescale Semiconductor Preliminary 56F8367/56F8167 Features Part 1 Overview 1.1 56F8367/56F8167 Features 1.1.1 • • • • • • • • • • • • • • Core Efficient 16-bit 56800E family controller engine with dual Harvard architecture Up to 60 M



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