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Part Number |
25X64 |
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Manufacturer |
Winbond |
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Semiconductor DataSheet |
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DataSheet View |
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W25X16, W25X16A, W25X32, W25X64
16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
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Publication Release Date: October 11, 2007 Revision G
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W25X16, W25X16A, W25X32, W25X64
Table of Contents
1. 2. 3. 4. 5. 6. 7. 8. GENERAL DESCRIPTION ......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5 PAD CONFIGURATION WSON 6X5-MM & 8X6-MM ................................................................ 5 PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, WSON 6X5-MM & 8X6-MM ..................... 6 PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7 PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7 8.1 8.2 8.3 8.4 8.5 8.6 8.7 9. 10. Package Types ............................................................................................................... 8 Chip Select (/CS) ............................................................................................................ 8 Serial Data Output (DO) ................................................................................................. 8 Write Protect (/WP)......................................................................................................... 8 HOLD (/HOLD) ............................................................................................................... 8 Serial Clock (CLK) .......................................................................................................... 8 Serial Data Input / Output (DIO) ..................................................................................... 8
BLOCK DIAGRAM ...................................................................................................................... 9 FUNCTIONAL DESCRIPTION ................................................................................................. 10 10.1 SPI OPERATIONS ....................................................................................................... 10
10.1.1 10.1.2 10.1.3 SPI Modes ....................................................................................................................10 Dual Output SPI............................................................................................................10 Hold Function ...............................................................................................................10 Write Protect Features..................................................................................................11
10.2 11.
WRITE PROTECTION.................................................................................................. 11
10.2.1
CONTROL AND STATUS REGISTERS................................................................................... 12 11.1 STATUS REGISTER .................................................................................................... 12
11.1.1 11.1.2 11.1.3 11.1.4 11.1.5 11.1.6 11.1.7 BUSY............................................................................................................................12 Write Enable Latch (WEL) ............................................................................................12 Block Protect Bits (BP2, BP1, BP0)..............................................................................12 Top/Bottom Block Protect (TB).....................................................................................12 Reserved Bits ...............................................................................................................12 Status Register Protect (SRP) ......................................................................................13 Status Register Memory Protection ..............................................................................14 Manufacturer and Device Identification.........................................................................16 Instruction Set...............................................................................................................17
11.2
INSTRUCTIONS........................................................................................................... 16
11.2.1 11.2.2
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W25X16, W25X16A, W25X32, W25X64
11.2.3 11.2.4 11.2.5 11.2.6 11.2.7 11.2.8 11.2.9 11.2.10 11.2.11 11.2.12 11.2.13 11.2.14 11.2.15 11.2.16 11.2.17 Write Enable (06h)........................................................................................................18 Write Disable (04h).......................................................................................................18 Read Status Register (05h) ..........................................................................................19 Write Status Register (01h) ..........................................................................................20 Read Data (03h) ...........................................................................................................21 Fast Read (0Bh) ...........................................................................................................22 Fast Read Dual Output (3Bh) .......................................................................................23 Page Program (02h) ...................................................................................................24 Sector Erase (20h) .....................................................................................................25 Block Erase (D8h) ......................................................................................................26 Chip Erase (C7h)........................................................................................................27 Power-down (B9h) ......................................................................................................28 Release Power-down / Device ID (ABh) .....................................................................29 Read Manufacturer / Device ID (90h) .........................................................................31 JEDEC ID (9Fh)..........................................................................................................32
12.
ELECTRICAL CHARACTERISTICS......................................................................................... 33 12.1 12.2 12.3 12.4 12.5 12.6 12.7 12.8 12.9 12.10 12.11 Absolute Maximum Ratings .......................................................................................... 33 Operating Ranges......................................................................................................... 33 Endurance and Data Retention .................................................................................... 34 Power-up Timing and Write Inhibit Threshold .............................................................. 34 DC Electrical Characteristics ........................................................................................ 35 AC Measurement Conditions........................................................................................ 36 AC Electrical Characteristics ........................................................................................ 37 AC Electrical Characteristics (cont’d) ........................................................................... 38 Serial Output Timing ..................................................................................................... 39 Input Timing................................................................................................................. 39 Hold Timing ................................................................................................................. 39 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 40 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 41 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 42 8-Contact 6x5mm WSON Cont’d.................................................................................. 43 8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 44 16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 45
13.
PACKAGE SPECIFICATION .................................................................................................... 40 13.1 13.2 13.3 13.4 13.5 13.6
14. 15.
ORDERING INFORMATION .................................................................................................... 46 REVISION HISTORY ................................................................................................................ 48
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Publication Release Date: October 11, 2007 Revision G
www.DataSheet4U.com
W25X16, W25X16A, W25X32, W25X64
1. GENERAL DESCRIPTION
The W25X16/W25X16A (16M-bit), W25X32 (32M-bit), and W25X64 (64M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25X16/16A/32/ |