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Samsung semiconductor
Samsung semiconductor

K4T1G164QQ Datasheet

(K4T1G044QQ - K4T1G164QQ) 1Gb A-die DDR2 SDRAM Specification


K4T1G164QQ Datasheet Preview


K4T1G044QQ
K4T1G084QQ
K4T1G164QQ
DDR2 SDRAM
1Gb Q-die DDR2 SDRAM Specification
www.DataSheet4U.com
60FBGA & 84FBGA with Pb-Free & Halogen-Free
(RoHS compliant)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
1 of 44
Rev. 1.01 November 2007
Page 1

K4T1G044QQ
K4T1G084QQ
K4T1G164QQ
Table of Contents
DDR2 SDRAM
1.0 Ordering Information ................................................................................................................... 4
2.0 Key Features ................................................................................................................................ 4
3.0 Package Pinout/Mechanical Dimension & Addressing ............................................................ 5
3.1 x4/x8 package pinout (Top View) : 60ball FBGA Package ................................................................... 5
3.2 x16 package pinout (Top View) : 84ball FBGA Package ...................................................................... 6
3.3 FBGA Package Dimension (x4/x8) ................................................................................................... 7
3.4 FBGA Package Dimension (x16) ...................................................................................................... 8
4.0 Input/Output Functional Description ......................................................................................... 9
www.Da5ta.S0heDetD4UR.c2omSDRAM Addressing ........................................................................................................ 10
6.0 Absolute Maximum DC Ratings ................................................................................................ 11
7.0 AC & DC Operating Conditions ................................................................................................ 11
7.1 Recommended DC Operating Conditions (SSTL - 1.8) ...................................................................... 11
7.2 Operating Temperature Condition ................................................................................................. 12
7.3 Input DC Logic Level ................................................................................................................... 12
7.4 Input AC Logic Level ................................................................................................................... 12
7.5 AC Input Test Conditions ............................................................................................................. 12
7.6 Differential input AC logic Level .................................................................................................... 13
7.7 Differential AC output parameters ................................................................................................. 13
8.0 ODT DC electrical characteristics ............................................................................................ 13
9.0 OCD default characteristics ...................................................................................................... 14
10.0 IDD Specification Parameters and Test Conditions ............................................................. 15
11.0 DDR2 SDRAM IDD Spec Table ................................................................................................ 17
12.0 Input/Output capacitance ........................................................................................................ 18
13.0 Electrical Characteristics & AC Timing for DDR2-800/667.................................................... 18
13.1 Refresh Parameters by Device Density ......................................................................................... 18
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin .............................................. 18
13.3 Timing Parameters by Speed Grade ............................................................................................. 19
14.0 General notes, which may apply for all AC parameters ....................................................... 21
15.0 Specific Notes for dedicated AC parameters ........................................................................ 23
2 of 44
Rev. 1.01 November 2007
Page 2

K4T1G044QQ
K4T1G084QQ
K4T1G164QQ
Revision History
Revision
1.0
1.01
Month
September
November
Year
2007
2007
- Initial Release
- Typo Correction
History
DDR2 SDRAM
www.DataSheet4U.com
3 of 44
Rev. 1.01 November 2007
Page 3
Part Number K4T1G164QQ
Manufactur Samsung semiconductor
Description (K4T1G044QQ - K4T1G164QQ) 1Gb A-die DDR2 SDRAM Specification
Total Page 30 Pages
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