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Toshiba Semiconductor
Toshiba Semiconductor

K2746 Datasheet

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2SK2746
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π−MOSIII)
2SK2746
DCDC Converter and Motor Drive Applications
z Low drainsource ON resistance : RDS (ON) = 1.3 (typ.)
z High forward transfer admittance : |Yfs| = 5.0 S (typ.)
z Low leakage current
: IDSS = 100 μA (max) (VDS = 640 V)
z Enhancement mode
: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drainsource voltage
Draingate voltage (RGS = 20 k)
Gatesource voltage
Drain current
DC (Note 1)
Pulse (Note 1)
Drain power dissipation (Tc = 25°C)
Single pulse avalanche energy
(Note 2)
Avalanche current
Repetitive avalanche energy (Note 3)
Channel temperature
Storage temperature range
VDSS
VDGR
VGSS
ID
IDP
PD
EAS
IAR
EAR
Tch
Tstg
800
800
±30
7
21
150
673
7
15
150
55~150
V
V
V
A
A
W
mJ
A
mJ
°C
°C
1. GATE
2. DRAIN (HEAT SINK)
3. SOURCE
JEDEC
JEITA
TOSHIBA
2-16C1B
Weight: 4.6 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Symbol
Max Unit
Thermal resistance, channel to case
Thermal resistance, channel to
ambient
Rth (chc)
Rth (cha)
0.833
50
°C / W
°C / W
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2: VDD = 90 V, Tch = 25°C (initial), L = 24.9 mH, RG = 25 , IAR = 7 A
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device.
Please handle with caution.
1 2006-11-10
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Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Gate leakage current
Gatesource breakdown voltage
Drain cutoff current
Drainsource breakdown voltage
Gate threshold voltage
Drainsource ON resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
IGSS
V (BR) GSS
IDSS
V (BR) DSS
Vth
RDS (ON)
|Yfs|
Ciss
Crss
Coss
VGS = ±30 V, VDS = 0 V
IG = ±10 μA, VDS = 0 V
VDS = 640 V, VGS = 0 V
ID = 10 mA, VGS = 0 V
VDS = 10 V, ID = 1 mA
VGS = 10 V, ID = 3.5 A
VDS = 20 V, ID = 3.5 A
VDS = 25 V, VGS = 0 V, f = 1 MHz
Rise time
tr
2SK2746
Min Typ. Max
— — ±10
±30 —
— — 100
800 —
2.0 — 4.0
— 1.3 1.7
1.25 5.0
— 1500 —
— 30 —
— 140 —
Unit
μA
V
μA
V
V
S
pF
— 35 —
Switching time
Turnon time
Fall time
ton
tf
— 80 —
ns
— 50 —
Turnoff time
Total gate charge (gatesource
plus gatedrain)
Gatesource charge
Gatedrain (“miller”) Charge
toff
Qg
Qgs VDD 400 V, VGS = 10 V, ID = 7 A
Qgd
— 220 —
— 55 —
— 30 —
— 25 —
nC
SourceDrain Ratings and Characteristics (Ta = 25°C)
Characteristics
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
Symbol
IDR
IDRP
VDSF
trr
Qrr
Test Condition
Min Typ. Max Unit
— —— 7 A
— — — 21 A
IDR = 7 A, VGS = 0 V
— — 1.9 V
— 1300 —
IDR = 7 A, VGS = 0 V, dIDR / dt = 100 A / μs
— 14 —
ns
μC
Marking
TOSHIBA
K2746
Part No. (or abbreviation code)
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
2
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2SK2746
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2SK2746
4 2006-11-10
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Page 4
Part Number K2746
Manufactur Toshiba Semiconductor
Description Search -----> 2SK2746
Total Page 6 Pages
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