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STMicroelectronics Electronic Components Datasheet

LIS302DL Datasheet

MEMS Motion Sensor

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LIS302DL pdf
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LIS302DL
MEMS motion sensor
3-axis - ±2g/±8g smart digital output “piccolo” accelerometer
Preliminary Data
Feature
2.16V to 3.6V supply voltage
1.8V compatible IOs
<1mW power consumption
±2g/±8g dynamically selectable Full-Scale
I2C/SPI digital output interface
Programmable multiple interrupt generator
Embedded high pass filter
Embedded self test
10000g high shock survivability
ECOPACK® RoHS and “Green” compliant
(see Section 8)
Description
The LIS302DL is an ultra compact low-power
three axes linear accelerometer. It includes a
sensing element and an IC interface able to
provide the measured acceleration to the external
world through I2C/SPI serial interface.
The sensing element, capable of detecting the
acceleration, is manufactured using a dedicated
process developed by ST to produce inertial
sensors and actuators in silicon.
The IC interface is manufactured using a CMOS
process that allows to design a dedicated circuit
which is trimmed to better match the sensing
element characteristics.
The LIS302DL has dynamically user selectable
full scales of ±2g/±8g and it is capable of
measuring accelerations with an output data rate
of 100Hz or 400Hz.
Order codes
LGA-14 (3x5x0.9mm)
A self-test capability allows the user to check the
functioning of the sensor in the final application.
The device may be configured to generate inertial
wake-up/free-fall interrupt signals when a
programmable acceleration threshold is crossed
at least in one of the three axes. Thresholds and
timing of interrupt generators are completely
programmable by the end user on the fly.
The LIS302DL is available in plastic Thin Land
Grid Array package (TLGA) and it is guaranteed
to operate over an extended temperature range
from -40°C to +85°C.
The LIS302DL belongs to a family of products
suitable for a variety of applications:
– Free-Fall detection
– Motion activated functions
– Gaming and Virtual Reality input
devices
– Vibration Monitoring and Compensation
Part number
LIS302DL
LIS302DLTR
Temp range, °C
-40 to +85
-40 to +85
Package
LGA
LGA
Packing
Tray
Tape and reel
October 2006
Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/29
www.st.com
29
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STMicroelectronics Electronic Components Datasheet

LIS302DL Datasheet

MEMS Motion Sensor

No Preview Available !

LIS302DL pdf
www.DataSheet4U.com
Contents
Contents
LIS302DL
1 Block diagram & pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4.2 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4.3 Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Digital Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1 I2C Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2.1 SPI Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.2.2 SPI Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.2.3 SPI Read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.1 WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/29
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Part Number LIS302DL
Description MEMS Motion Sensor
Maker ST Microelectronics
Total Page 29 Pages
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