Figure 2. Simplified Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
wDFN6, 2 x 2
6 OUT Regulated output voltage pin. A small 0.47 mF ceramic capacitor is needed from this pin to ground to
2 N/C No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
GND Power supply ground. Exposed pad EXP must be tied with GND pin 3.
4 N/C No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
5 N/C No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
1 IN Input pin. A small capacitor is needed from this pin to ground to assure stability.
Table 2. ABSOLUTE MAXIMUM RATINGS
Input Voltage (Note 1)
VIN −0.3 to 24
−0.3 to 5
Output Short Circuit Duration
Maximum Junction Temperature
−55 to 150
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latch up Current Maximum Rating tested per JEDEC standard: JESD78
Table 3. THERMAL CHARACTERISTICS
Thermal Characteristics, wDFN6, 2 mm x 2 mm
Thermal Resistance, Junction−to−Air