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  NEC Electronic Components Datasheet  

MC-7847-KC Datasheet

25 dB POWER DOUBLER AM PLI FI ER

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MC-7847-KC pdf
NEC's 870 MHz GaAs CATV
25 dB POWER DOUBLER AMPLIFIER MC-7847-KC
FEATURES
• GaAs ACTIVE DEVICES
• LOW DISTORTION
• HIGH LINEAR GAIN:
MC-7847-KC - GL = 25 dB MIN at f = 870 MHz
LOW RETURN LOSS
LOW GAIN CHANGE OVER TEMPERATURE
SPECIFIED FOR 79, 110, and 132 CHANNELS
PERFORMANCE
HIGH RELIABILITY AND RUGGEDNESS:
Withstands environmental extremes as well as Silicon
devices (Surge, ESD, Etc.)
DESCRIPTION
NEC's MC-7847-KC is a GaAs Multi-Chip Modules designed
for use as output stages in CATV applications up to 870 MHz.
This is a high gain device offering 25 dB minimum gain at
870 MHz. Because this unit is a GaAs device it has low dis-
tortion, low noise gure, and low return loss across the entire
frequency band.
The MC-7847-KC is similar to NEC's standard push-pull
devices, but the higher current allows for better distortion
performance, especially X-mod.
Like the previous generation of products, these devices sur-
vive such hazards as surge and ESD as well as their silicon
competitors, but deliver superior performance with low DC
current required. All devices are assembled and tested using
fully automated equipment to maximize consistency in part to
part performance, and reliability is assured by NEC's stringent
quality and process control procedures. These parts come in
industry compatible hybrid packages.
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE H02
3.2 MAX
14.85 MAX
8.1 MAX
45.08 MAX
38.1±0.25
27.5 MAX
19.05±0.38
25.4±0.25
2.54±0.25
12 3 5 789
4.25
+
-
0.25
0.35
4.0±0.25
6-32 unc 2B
21.5 MAX
4.19±0.13 A
0.38.. A
0.51±0.05
6.3 2.5
±0.05
VDD
5
19
In Out
2 378
0.51±0.05
Gnd
10.75 ±0.25
2.54 ±0.38
APPLICATIONS
• CATV HEADEND SYSTEMS
• CATV OPTICAL NODES
• CATV DISTRIBUTION AMPS
ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 )
SYMBOLS
PART NUMBER
CHARACTERISTICS
UNITS
MC-7847-KC
MIN TYP MAX
TEST CONDITIONS
BW Frequency Range
GL Linear Gain
S Gain Slope
Gf Gain Flatness
Noise Figure 1
NF
Noise Figure 2
RLi Input Return Loss
RLO
IDD
CTB
XMod
CSO
Output Return Loss
Operating Current
Composite Triple Beat
Cross Modulation1
Composite Second Order
MHz
50
– 870
dB 25.0 – 26.0 f = 870 MHz
dB 1.0 1.4 1.8 f = 40 to 870 MHz
dB –
– 0.6 40 to 870 MHz; Peak to Valley
dB –
– 5.5 f = 50 MHz
– – 6.0 f = 870 MHz
dB 20.0
– 40 to 160MHz
20.0 –
– 160 to 320 MHz
19.5 –
– 320 to 640 MHz
17.0 –
– 640 to 870 MHz
mA 20.0
– 40 to 160MHz
mA 350 – 420 RF OFF
dBc –
– -60 110 Channels
dBc –
dBc –
– -55 VOUT = 50 dBmV at 745.25 MHz, 10 dB
– -63 tilted across the band
1. Measured per US standard methods and procedures (using selective level meter).
California Eastern Laboratories


  NEC Electronic Components Datasheet  

MC-7847-KC Datasheet

25 dB POWER DOUBLER AM PLI FI ER

No Preview Available !

MC-7847-KC pdf
MC-7847-KC
ABSOLUTE
MAXIMUM RATINGS1 (TCASE= 30 °C)
SYMBOLS
PARAMETERS
UNITS RATINGS
VDD Supply Voltage
V 30
VI
Input Voltage (Single Tone)2 dBmV
65
TC Operating Case Temperature °C -30 to +100
TSTG
Storage Temperature
°C -40 to +100
Note:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Maximum single channel power applied to the input for 1 minute
with no measurable degradation in performance.
RECOMMENDED
OPERATING CONDITIONS (Zs = ZL = 75)
SYMBOLS
PARAMETERS
UNITS MIN TYP MAX
VDD Supply VoltageV
23.5 24.0 24.5
Vi Input Voltage1,
MC-7847-KC
dBmV – 32.0 35.0
TC Operating Case
Temperature
°C -30 +25 +85
Note:
1. Test Conditions: 110 Channels, 10 dB tilted across the band.
ORDERING INFORMATION
PART NUMBER
PACKAGE
QUANTITY
MC-7847-KC 7-pin special with heatsink 50pcs max/ Tray
NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
1. The space between PC board and root of the lead should be kept
more than 1 mm to prevent undesired stress on the lead and also
should be kept less than 4 mm to prevent undesired parasitic
inductance.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the recom-
mended conditions are to be consulted with our sales representa-
tives.
Soldering
Method
Soldering
Conditions
Condition
Symbol
Pin Part Heating
Pin area temperature: less
than 260°C1
Hour: Within 2 sec./pin
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
01/28/2004


Part Number MC-7847-KC
Description 25 dB POWER DOUBLER AM PLI FI ER
Maker NEC
Total Page 2 Pages
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