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  Microchip Technology Semiconductor Electronic Components Datasheet  

MCP2004A Datasheet

LIN J2602 Transceiver

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MCP2004A pdf
MCP2003/4/3A/4A
LIN J2602 Transceiver
Features:
• The MCP2003/2003A and MCP2004/2004A are
compliant with Local Interconnect Network (LIN)
Bus Specifications 1.3, 2.0 and 2.1 and are
compliant to SAE J2602
• Support Baud Rates up to 20 kbaudwith
LIN-Compatible Output Driver
• 43V Load Dump Protected
• Very Low High Electromagnetic Immunity (EMI)
meets Stringent Original Equipment Manufactur-
ers (OEM) Requirements
• Very High Electrostatic Discharge (ESD)
Immunity:
- >20 kV on VBB (IEC 61000-4-2)
- >14 kV on LBUS (IEC 61000-4-2)
• Very High Immunity to RF Disturbances meets
Stringent OEM Requirements
• Wide Supply Voltage, 6.0V-27.0V Continuous
• Extended Temperature Range: -40 to +125°C
• Interface to PIC® MCU EUSART and Standard
USARTs
• LIN Bus Pin:
- Internal pull-up resistor and diode
- Protected against battery shorts
- Protected against loss of ground
- High current drive
• Automatic Thermal Shutdown
• Low-Power mode:
- Receiver monitoring bus and transmitter off,
(5 µA)
Description:
This device provides a bidirectional, half-duplex
communication, physical interface to automotive and
industrial LIN systems to meet the LIN Bus
Specification Revision 2.1 and SAE J2602. The device
is short-circuit and over-temperature protected by
internal circuitry. The device has been specifically
designed to operate in the automotive operating
environment and will survive all specified transient
conditions while meeting all of the stringent quiescent
current requirements.
MCP200X family members:
• 8-pin PDIP, DFN and SOIC packages:
- MCP2003, LIN-compatible driver, with WAKE
pins, wake-up on falling edge of LBUS
- MCP2003A, LIN-compatible driver, with
WAKE pins, wake-up on rising edge of LBUS
- MCP2004, LIN-compatible driver, with
FAULT/TXE pins, wake-up on falling edge of
LBUS
- MCP2004A, LIN-compatible driver, with
FAULT/TXE pins, wake-up on rising edge of
LBUS
Package Types
MCP2003/2003A
PDIP, SOIC
MCP2004/2004A
PDIP, SOIC
RXD 1
CS 2
WAKE 3
TXD 4
8 VREN
RXD 1
7 VBB CS/WAKE 2
6 LBUS FAULT/TXE 3
5 VSS
TXD 4
8 VREN
7 VBB
6 LBUS
5 VSS
MCP2003/2003A
4x4 DFN*
MCP2004/2004A
4x4 DFN*
RXD 1
8 VREN
RXD 1
8 VREN
CS 2 EP 7 VBB CS/WAKE 2 EP 7 VBB
WAKE 3 9 6 LBUS FAULT/TXE 3 9 6 LBUS
TXD 4
5 VSS
TXD 4
5 VSS
* Includes Exposed Thermal Pad (EP); see Table 1-2.
2010-2014 Microchip Technology Inc.
DS20002230F-page 1



  Microchip Technology Semiconductor Electronic Components Datasheet  

MCP2004A Datasheet

LIN J2602 Transceiver

No Preview Available !

MCP2004A pdf
MCP2003/4/3A/4A
MCP2003/2003A Block Diagram
VREN
4.3V
RXD
CS
TXD
Wake-Up
Logic and
Power Control
OC
Thermal
Protection
Ratiometric
Reference
VBB
WAKE
~30 k
LBUS
Short Circuit
Protection
VSS
MCP2004/2004A Block Diagram
VREN
4.3V 4.3V
RXD
CS/WAKE
TXD
FAULT/TXE
Wake-Up
Logic and
Power Control
Ratiometric
Reference
VBB
OC
Thermal
Protection
~30 k
LBUS
Short Circuit
Protection
VSS
DS20002230F-page 2
2010-2014 Microchip Technology Inc.



  Microchip Technology Semiconductor Electronic Components Datasheet  

MCP2004A Datasheet

LIN J2602 Transceiver

No Preview Available !

MCP2004A pdf
1.0 DEVICE OVERVIEW
The MCP2003/4/3A/4A devices provide a physical
interface between a microcontroller and a LIN bus.
These devices will translate the CMOS/TTL logic levels
to LIN logic level, and vice versa. It is intended for
automotive and industrial applications with serial bus
speeds up to 20 kbaud.
LIN Bus Specification Revision 2.1 requires that the
transceiver of all nodes in the system is connected via
the LIN pin, referenced to ground and with a maximum
external termination resistance load of 510from LIN
bus to battery supply. The 510 corresponds to
1 master and 15 slave nodes.
The VREN pin can be used to drive the logic input of an
external voltage regulator. This pin is high in all modes
except for Power-Down mode.
1.1 External Protection
1.1.1 REVERSE BATTERY PROTECTION
An external reverse-battery-blocking diode should be
used to provide polarity protection (see Example 1-1).
1.1.2
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
An external 43V transient suppressor (TVS) diode,
between VBB and ground, with a 50transient
protection resistor (RTP) in series with the battery
supply and the VBB pin serve to protect the device from
power transients (see Example 1-1) and ESD events.
While this protection is optional, it is considered good
engineering practice.
1.2 Internal Protection
1.2.1 ESD PROTECTION
For component-level ESD ratings, please refer to the
maximum operation specifications.
1.2.2 GROUND LOSS PROTECTION
The LIN Bus specification states that the LIN pin must
transition to the recessive state when ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a high-impedance level.
MCP2003/4/3A/4A
1.2.3 THERMAL PROTECTION
The thermal protection circuit monitors the die
temperature and is able to shut down the LIN
transmitter.
There are two causes for a thermal overload. A thermal
shutdown can be triggered by either, or both, of the
following thermal overload conditions.
• LIN bus output overload
• Increase in die temperature due to increase in
environment temperature
Driving the TXD and checking the RXD pin makes it
possible to determine whether there is a bus contention
(Rx = low, Tx = high) or a thermal overload condition
(Rx = high, Tx = low). After a thermal overload event,
the device will automatically recover once the die
temperature has fallen below the recovery temperature
threshold (see Figure 1-1).
FIGURE 1-1:
THERMAL SHUTDOWN
STATE DIAGRAM
Shorted LIN bus
to VBB
Operation
Mode
Transmitter
Shutdown
Temp < ShutdownTEMP
2010-2014 Microchip Technology Inc.
DS20002230F-page 3




Part Number MCP2004A
Description LIN J2602 Transceiver
Maker Microchip
Total Page 30 Pages
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MCP2004A pdf
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