| Description | International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon rather than through protruding lead... |
| Features |
• Ultra Low VF To Footprint Area • • • Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel Applications • Reverse Polarity Protection • • • • Current Steering Freewheeling Flyback Oring FlipKYTM Major Ratings and Characteristics Characteristics IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 μs sine VF TJ @ 0.5 Apk... |
| Datasheet |
 IR05H40CSPTR Datasheet - 179.26KB |
