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Infineon Technologies Electronic Components Datasheet

AUIRFU5305 Datasheet

Power MOSFET

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AUIRFU5305 pdf
  AUTOMOTIVE GRADE
Features
Advanced Planar Technology
Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
 
Description
Specifically designed for Automotive applications, this Cellular
Planar design of HEXFET® Power MOSFETs utilizes the latest
processing techniques to achieve low on-resistance per silicon
area. This benefit combined with the fast switching speed and
ruggedized device design that HEXFET power MOSFETs are
well known for, provides the designer with an extremely efficient
and reliable device for use in Automotive and a wide variety of
other applications.
VDSS
RDS(on)
ID
AUIRFR5305
AUIRFU5305
max.
-55V
0.065
-31A
D
D
S
G
D-Pak
AUIRFR5305
S
GD
I-Pak
AUIRFU5305
G
Gate
D
Drain
S
Source
Base part number
AUIRFU5305
AUIRFR5305
Package Type
I-Pak
D-Pak
Standard Pack
Form
Quantity
Tube
75
Tube
75
Tape and Reel Left
3000
Orderable Part Number
AUIRFU5305
AUIRFR5305
AUIRFR5305TRL
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Symbol
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
TSTG
Parameter
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
Pulsed Drain Current 
Maximum Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited) 
Avalanche Current 
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Thermal Resistance  
Symbol
Parameter
RJC Junction-to-Case
RJA Junction-to-Ambient ( PCB Mount)
RJA Junction-to-Ambient
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
1
Max.
-31
-22
-110
110
0.71
± 20
280
-16
11
-5.0
-55 to + 175
300
Typ.
–––
–––
–––
Max.
1.4
50
110
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
 
°C 
 
Units
°C/W
2015-10-12


Infineon Technologies Electronic Components Datasheet

AUIRFU5305 Datasheet

Power MOSFET

No Preview Available !

AUIRFU5305 pdf
  AUIRFR/U5305
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
V(BR)DSS/TJ
RDS(on)
VGS(th)
gfs
IDSS
IGSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Trans conductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
-55 ––– ––– V VGS = 0V, ID = -250µA
––– -0.034 ––– V/°C Reference to 25°C, ID = -1mA
––– ––– 0.065  VGS = -10V, ID = -16A
-2.0 ––– -4.0 V VDS = VGS, ID = -250µA
8.0 ––– ––– S VDS = -25V, ID = -16A
–––
–––
––– -25
––– -250
µA
VDS = -55 V, VGS = 0V
VDS = -44V,VGS = 0V,TJ =150°C
–––
–––
––– -100
––– 100
nA
VGS = -20V
VGS = 20V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Qg Total Gate Charge
Qgs Gate-to-Source Charge
Qgd Gate-to-Drain Charge
td(on) Turn-On Delay Time
tr Rise Time
td(off) Turn-Off Delay Time
tf Fall Time
LD Internal Drain Inductance
LS Internal Source Inductance
––– ––– 63
ID = -16A
––– ––– 13 nC   VDS = -44V
––– ––– 29
VGS = -10V, See Fig 6 and 13 
––– 14 –––
VDD = -28V
–––
–––
66
39
–––
–––
ns
ID = -16A
RG = 6.8
––– 63 –––
RD = 1.6See Fig 10 
–––
–––
4.5
7.5
–––
–––
Between lead,
nH
 
6mm (0.25in.)
from package
and center of die contact
Ciss Input Capacitance
Coss Output Capacitance
Crss Reverse Transfer Capacitance
Diode Characteristics  
––– 1200 –––
––– 520 –––
––– 250 –––
VGS = 0V
pF   VDS = -25V
ƒ = 1.0MHz, See Fig. 5
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
VSD Diode Forward Voltage
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
Min.
–––
–––
–––
–––
–––
Typ.
–––
–––
–––
71
170
Max. Units
Conditions
-31
-110
MOSFET symbol
A
showing the
integral reverse
p-n junction diode.
-1.3 V TJ = 25°C,IS = -16A,VGS = 0V 
110 ns TJ = 25°C ,IF = -16A
250 nC di/dt = 100A/µs 
Notes:
Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)
VDD = -25V, starting TJ = 25°C, L = 2.1mH, RG = 25, IAS = -16A. (See Fig.12)
ISD -16A, di/dt -280A/µs, VDD V(BR)DSS, TJ 175°C.
Pulse width 300µs; duty cycle 2%.
This is applied for I-PAK, LS of D-PAK is measured between lead and center of die contact .
Uses IRF5305 data and test conditions.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to
application note #AN-994
Uses typical socket mount.
2 2015-10-12


Part Number AUIRFU5305
Description Power MOSFET
Maker Infineon
Total Page 11 Pages
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