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Integrated Silicon Solution Electronic Components Datasheet

IS61QDPB42M36 Datasheet

QUADP (Burst of 4) Synchronous SRAMs

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IS61QDPB42M36 pdf
72 Mb (2M x 36 & 4M x 18)
7 QUADP (Burst. of 4) Synchronous SRAMs
IQ
May 2009
Features
2M x 36 or 4M x 18.
• On-chip delay-locked loop (DLL) for wide data
valid window.
• Separate read and write ports with concurrent
read and write operations.
• Synchronous pipeline read with late write opera-
tion.
• Double data rate (DDR) interface for read and
write input ports.
• Fixed 4-bit burst for read and write operations.
• Clock stop support.
• Two input clocks (K and K) for address and con-
trol registering at rising edges only.
• Two echo clocks (CQ and CQ) that are delivered
simultaneously with data.
• +1.8V core power supply and 1.5, 1.8V VDDQ,
used with 0.75, 0.9V VREF.
• HSTL input and output levels.
• Registered addresses, write and read controls,
byte writes, data in, and data outputs.
• Full data coherency.
• Boundary scan using limited set of JTAG 1149.1
functions.
• Byte write capability.
• Fine ball grid array (FBGA) package
- 15mm x 17mm body size
- 1mm pitch
- 165-ball (11 x 15) array
• Programmable impedance output drivers via 5x
user-supplied precision resistor.
Description
The 72Mb IS61QDPB42M36 and
IS61QDPB44M18 are synchronous, high-perfor-
mance CMOS static random access memory
(SRAM) devices. These SRAMs have separate I/Os,
eliminating the need for high-speed bus turnaround.
The rising edge of K clock initiates the read/write
operation, and all internal operations are self-timed.
Refer to the Timing Reference Diagram for Truth
Table on page 8 for a description of the basic opera-
tions of these QUADP (Burst of 4) SRAMs.
Read and write addresses are registered on alter-
nating rising edges of the K clock. Reads and writes
are performed in double data rate. The following are
registered internally on the rising edge of the K
clock:
• Read/write address
• Read enable
• Write enable
• Byte writes for burst addresses 1 and 3
• Data-in for burst addresses 1 and 3
The following are registered on the rising edge of
the K clock:
• Byte writes for burst addresses 2 and 4
• Data-in for burst addresses 2 and 4
Byte writes can change with the corresponding data-
in to enable or disable writes on a per-byte basis. An
internal write buffer enables the data-ins to be regis-
tered one cycle after the write address. The first
data-in burst is clocked one cycle later than the write
command signal, and the second burst is timed to
the following rising edge of the K clock. Two full
clock cycles are required to complete a write opera-
tion.
The device is operated with a single +1.8V power
supply and is compatible with HSTL I/O interfaces.
Integrated Silicon Solution, Inc.
Rev. A
05/14/09
1


Integrated Silicon Solution Electronic Components Datasheet

IS61QDPB42M36 Datasheet

QUADP (Burst of 4) Synchronous SRAMs

No Preview Available !

IS61QDPB42M36 pdf
72 Mb (2M x 36 & 4M x 18)
QUADP (Burst of 4) Synchronous SRAMs
x36 FBGA Pinout (Top View)
1 2 3 4 5 6 7 8 9 10 11
A CQ NC/SA* SA
W BW2
K
BW1
R
SA
NC/SA*
CQ
B Q27 Q18 D18 SA BW3 K BW0 SA D17 Q17 Q8
C D27 Q28 D19 VSS
SA
NC
SA VSS D16 Q7
D8
D D28 D20 Q19 VSS VSS VSS VSS VSS Q16 D15
D7
E Q29
D29
Q20
VDDQ
VSS
VSS
VSS
VDDQ
Q15
D6
Q6
F Q30
Q21
D21
VDDQ
VDD
VSS
VDD
VDDQ
D14
Q14
Q5
G D30
D22
Q22
VDDQ
VDD
VSS
VDD
VDDQ
Q13
D13
D5
H
Doff
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J D31
Q31
D23
VDDQ
VDD
VSS
VDD
VDDQ
D12
Q4
D4
K Q32
D32
Q23
VDDQ
VDD
VSS
VDD
VDDQ
Q12
D3
Q3
L Q33
Q24
D24
VDDQ
VSS
VSS
VSS
VDDQ
D11
Q11
Q2
M D33 Q34 D25 VSS VSS VSS VSS VSS D10 Q1
D2
N D34 D26 Q25 VSS
SA
SA
SA VSS Q10 D9
D1
P Q35 D35 Q26
SA
SA
NC SA
SA
Q9
D0
Q0
R TDO
TCK
SA
SA
SA
NC
SA
SA
SA TMS TDI
Note: *The following pins are reserved for higher densities: 10A for 144Mb, and 2A for 288Mb. QVLD pin (6P) is not supported.
x18 FBGA Pinout (Top View)
1 2 3 4 5 6 7 8 9 10
A CQ NC/SA* SA
W BW1 K
NC
R
SA SA
B NC Q9 D9 SA NC
K
BW0
SA
NC
NC
C NC NC D10 VSS SA NC SA VSS NC Q7
D NC D11 Q10 VSS VSS VSS VSS VSS NC NC
E NC
NC
Q11
VDDQ
VSS
VSS
VSS
VDDQ
NC
D6
F NC
Q12
D12
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
G NC
D13
Q13
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
H
Doff
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
J NC
NC
D14
VDDQ
VDD
VSS
VDD
VDDQ
NC
Q4
K NC
NC
Q14
VDDQ
VDD
VSS
VDD
VDDQ
NC
D3
L NC
Q15
D15
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
M NC
NC
D16
VSS
VSS
VSS
VSS
VSS
NC
Q1
N NC
D17 Q16 VSS
SA
SA
SA VSS NC
NC
P NC NC Q17 SA SA NC SA SA NC D0
R TDO
TCK
SA
SA
SA
NC
SA
SA
SA TMS
Note: *The following pins are reserved for higher densities: 2A for 144Mb. QVLD pin (6P) is not supported.
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
2 Integrated Silicon Solution, Inc.
Rev. A
05/14/09


Part Number IS61QDPB42M36
Description QUADP (Burst of 4) Synchronous SRAMs
Maker ISSI
Total Page 28 Pages
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