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MR18R326GAG0

Samsung semiconductor
Part Number MR18R326GAG0
Manufacturer Samsung semiconductor
Title (32Mx18) 16pcs RIMM Module based on 576Mb A-die
Description Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76,...
Features ♦ High speed up to 1066 MHz RDRAM storage ♦ 184 edge connector pads with 1mm pad spacing ♦ Module PCB size : 133.35mm x 34.93mm x 1.27mm ♦ Each RDRAM device has 32 banks, for a total of 512 ♦ Gold plated edge connector pad contacts ♦ Serial Presence ...

Datasheet PDF File MR18R326GAG0 Datasheet

MR18R326GAG0   MR18R326GAG0   MR18R326GAG0  




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