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MR18R162GAF0

Samsung semiconductor
Part Number MR18R162GAF0
Manufacturer Samsung semiconductor
Title (MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
Description Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76,...
Features 256M x 16/18 -CN9 -CM8 -CK8 ♦ High speed up to 1066 MHz RDRAM storage ♦ 184 edge connector pads with 1mm pad spacing ♦ Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module ♦ Module PCB size : 133.35mm x 34...

Datasheet PDF File MR18R162GAF0 Datasheet 419.61KB

MR18R162GAF0   MR18R162GAF0   MR18R162GAF0  




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