| Part Number | FBGA |
| Manufacturer | STATS ChipPAC |
| Title | Fine Pitch Ball Grid Array |
| Description | STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an ar... |
| Features |
• Thin, lightweight, space saving package • Flexible body sizes range from 4mm x 4mm to 23mm x 23mm • 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch • Eutectic & Pb free solder balls • Green package available • Multiple routing layers and dedicated ground... |
| Datasheet |
 FBGA Datasheet
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