Part Number | LPA6836V |
Manufacturer | Filtronic Compound Semiconductors |
Title | MEDIUM POWER PHEMT WITH SOURCE VIAS |
Description | AND APPLICATIONS DIE SIZE: 15.4X14.2 mils (390x360 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.0X3.0 mils (75x75 µm) The FPA6836V is an... |
Features |
♦ 25 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency ♦ Source Vias to Backside Metallization
DRAIN BOND PAD
LPA6836V
MEDIUM POWER PHEMT WITH SOURCE VIAS
GATE BOND PAD
• DESCRIPTION AND AP... |
Datasheet | LPA6836V Datasheet |