| Part Number | LP6872 |
| Manufacturer | Filtronic Compound Semiconductors |
| Title | 0.5W POWER PHEMT |
| Description | AND APPLICATIONS DIE SIZE: 14.6X19.7 mils (370x500 µm) DIE THICKNESS: 3.0 mils (75 µm) BONDING PADS: 1.9X2.4 mils (50x60 µm) The LP6872 is an Al... |
| Features |
♦ 27 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency
DRAIN BOND PAD (2X) SOURCE BOND PAD (2x)
LP6872
GATE BOND PAD (2X)
• DESCRIPTION AND APPLICATIONS DIE SIZE: 14.6X19.7 mils (370x500 µm... |
| Datasheet |
 LP6872 Datasheet 38.59KB |
