| Part Number | LP6836 |
| Manufacturer | Filtronic Compound Semiconductors |
| Title | MEDIUM POWER PHEMT |
| Description | AND APPLICATIONS DIE SIZE: 14.2X13.0 mils (360x330 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 1.9X1.9 mils (50x50 µm) The LP6836 is an A... |
| Features |
♦ 25 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency
DRAIN BOND PAD SOURCE BOND PAD (2x)
LP6836
GATE BOND PAD
• DESCRIPTION AND APPLICATIONS DIE SIZE: 14.2X13.0 mils (360x330 µm) DIE THIC... |
| Datasheet |
 LP6836 Datasheet
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