| Part Number | LP3000 |
| Manufacturer | Filtronic Compound Semiconductors |
| Title | 2W Power PHEMT |
| Description | AND APPLICATIONS DIE SIZE: 28.3X16.5 mils (720x420 µm) DIE THICKNESS: 2.6 mils (65 µm) BONDING PADS: 1.9X2.4 mils (50x60 µm) The LP3000 is an Al... |
| Features |
♦ 33.5 dBm Output Power at 1-dB Compression at 18 GHz ♦ 7 dB Power Gain at 18 GHz ♦ 30.5 dBm Output Power at 1-dB Compression at 3.3V ♦ 45% Power-Added Efficiency
DRAIN BOND PAD (4X) SOURCE BOND PAD (2x) GATE BOND PAD (4X)
LP3000
• DESCRIPTION AND... |
| Datasheet |
 LP3000 Datasheet 44.97KB |
