| Part Number | LP1500 |
| Manufacturer | Filtronic Compound Semiconductors |
| Title | 1W POWER PHEMT |
| Description | AND APPLICATIONS DIE SIZE: 16.5X16.1 mils (420x410 µm) DIE THICKNESS: 3 mils (75 µm) BONDING PADS: 1.9X2.4 mils (50x60 µm) The LP1500 is an Alum... |
| Features |
♦ 31.5 dBm Output Power at 1-dB Compression at 18 GHz ♦ 8 dB Power Gain at 18 GHz ♦ 28 dBm Output Power at 1-dB Compression at 3.3V ♦ 45dBm Output IP3 at 18GHz ♦ 50% Power-Added Efficiency
DRAIN BOND PAD (2X) SOURCE BOND PAD (2x) GATE BOND PAD (2X)
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| Datasheet |
 LP1500 Datasheet
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