| Part Number | HC1000 |
| Manufacturer | Bergquist |
| Title | Gel-Like Modulus Gap Filling Material |
| Description | Gap Pad® HC1000 “Gel-Like” Modulus Gap Filling Material Resultant Thickness (mils) Section A Section B Section C Section D Section E Features a... |
| Features |
and Benefits
• Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a th... |
| Datasheet |
 HC1000 Datasheet
|
